Generic placeholder image

Recent Patents on Mechanical Engineering

Editor-in-Chief

ISSN (Print): 2212-7976
ISSN (Online): 1874-477X

Recent Research of Electromagnetic Characteristics in Wire Bonding

Author(s): Wenchao Tian and Haoyue Ji

Volume 9, Issue 2, 2016

Page: [102 - 111] Pages: 10

DOI: 10.2174/2212797609666160309003015

Price: $65

Abstract

Wire bonding is still the dominant form of electronic packaging for its mature technology, low cost and high reliability. The development trend of electronic components is: small volume, high power, high frequency and high reliability. With the improvement of signal transmission frequency and device power, bonding wire cannot be regarded as simple transmission line with no loss. In this paper, the latest research status and various patents of wire bonding electromagnetic characteristics are summarized in three aspects: bonding wire, wire layout and packaging structure. The factors affecting the electromagnetic characteristics are summarized and several resolutions are proposed to improve the electrical properties. In the meantime, the prospect and development trends are described in this paper. With the study of bonding wire loop technology and electromagnetic properties, the wire bonding form can continue to meet the requirements of encapsulation process and be dominant solution of low cost encapsulation in a long time.

Keywords: Crosstalk, electrical connection, electromagnetic characteristics, electronic packaging, wire bonding, wire geometry.

Next »

Rights & Permissions Print Cite
© 2024 Bentham Science Publishers | Privacy Policy