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Recent Patents on Mechanical Engineering
ISSN (Print): 2212-7976
ISSN (Online): 1874-477X
VOLUME: 2
ISSUE: 1
DOI: 10.2174/2212797610902010019









Recent Patents in Fluid Dispensing Processes for Electronics Packaging

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Author(s): Minggan Li and Xiongbiao Chen
Pages 19-25 (7)
Abstract:
Fluid dispensing is a process to deliver fluid materials in a controlled manner. This method has been widely used in various processes/applications such as electronics assembly and microelectromechanical systems (MEMS) packaging. With an increasing demanding for smaller size and higher density of components on boards, numerous efforts have been made in industry to enhance the efficiency and accuracy of the dispensing process and some of the techniques resulted have been patented. This paper presents an overview of the recent patents in the dispensing approaches, and the dispensing process measurements and control in electronic packaging.
Keywords:
Fluid dispensing, packaging, control, viscosity, measurements, volume or amount
Affiliation:
Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, S7N 5A9, Canada.