Abstract
Snap thermal cure epoxy adhesives are typically one-component epoxy composition, comprising epoxy resin, a new type latent curing agent, and an accelerator with modifiers and additives. Snap thermal cure adhesives can cure very fast at certain elevated temperature conditions and have been very successfully used in semiconductor packaging and electronics module assembly applications.
Keywords: Accelerator, Anisotropic conductive film (ACF), Dicyandiamide, Imidazole, Non-conductive paste (NCP), Thermal cationic initiator.
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